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2013 International Conference on Microtechnology and MEMS (ICMM 2013) 2013年显微技术和 微电子机械系统国际学术研讨会

2013 International Conference on Microtechnology and MEMS (ICMM 2013)

2013年显微技术和 微电子机械系统国际学术研讨会

May 22-23, Bejing,China    2013522-23号中国北京

会议网址:http://www.icmm-conf.org/

2013 International Conference on Microtechnology and MEMS (ICMM 2013) will be held on May 22-23, Bejing, China

ICMM 2013 has been entered the publisher website

http://www.scientific.net/conference-759

 

All accepted papers from ICMM 2013 will also be published on international journal Applied Mechanics and Materials(ISSN:1660-9336) and will be indexed in EI Compendex, Thomson ISTP and Elsevier SCOPUS databases. Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. Selected excellent papers will be published on international reputation journals.

The following Topics are enthusiastically encouraged but not limited to:

Mechanics

Materials Science and Materials Processing Technology

Design and Manufacturing

Automation, Control, Information Technology and MEMS

力学材料科学与材料加工技术设计与制造自动化控制,信息技术和微电子系统等相关主题文章均可投稿,

http://www.icmm-conf.org/cfp.htm

投稿系统已开放,欢迎投稿:

https://www.easychair.org/conferences/?conf=icmm2013

初稿时,中文或英文投稿均可,但一旦录用后,所有文章需全部翻译成英文。

Important Dates:

Paper submissions due         (投稿截止): March 25, 2013

Paper notification of acceptance (录用通知): 1-2 weeks after submission

Paper registration deadline     (注册截止): before March 28, 2013

Conference Date              (会议时间): May 22-23, 2013

Contact:

Email: icmm2013@163.com  Tel: 18086038213;027- 87772193